AlN / Al2O3 Ceramic Semiconductor Package For Power Device RF Module Encapsulation
Brand Name:
XQCERA
Model Number:
Customization
Place of Origin:
Hunan, China
Certification:
IATF16949;ISO9001
MOQ:
100
Price:
Customization
Delivery Time:
20-30 working days
Payment Terms:
TT wire transfer
Standard Packaging:
Carton; Pallet
Product Details
Highlight:
Al2O3 Ceramic Semiconductor
,AlN Ceramic Semiconductor
,Ceramic Semiconductor Package
Material:
Zirconia Ceramic (ZrO₂, Y-TZP)
Purity:
≥94% / ≥95% (custom Grades Available)
Density:
≥6.0 G/cm³
Fracture Toughness:
6–10 MPa·m½
Flexural Strength:
≥900–1200 MPa
Hardness:
≥88–92 HRA
Color:
White / Black / Customized
Max Working Temperature:
800–1600°C
Surface Finish:
Polished / Ground
Thermal Shock Resistance:
Excellent
Electrical Insulation:
Excellent
Corrosion Resistance:
Excellent
Wear Resistance:
Excellent
Customization:
Size, Tolerance, Diameter, Thickness,holes, Metallization Optional
Product Description
Detailed Specifications & Features
Ceramic Semiconductor Package | High Thermal Conductivity AlN/Al2O3 for Power Device (IGBT, MOSFET) & RF Module Encapsulation
High-performance ceramic semiconductor packages featuring exceptional thermal conductivity using AlN (Aluminum Nitride) and Al₂O₃ (Aluminum Oxide) materials. Engineered for superior heat dissipation and reliable performance in demanding electronic applications.
Key Features
- Exceptional thermal conductivity for efficient heat management
- Available in AlN and Al₂O₃ ceramic formulations
- Superior electrical insulation properties
- Excellent mechanical strength and durability
- High temperature stability and reliability
- Precision manufacturing for consistent performance
Primary Applications
- Power Device Encapsulation (IGBT, MOSFET)
- RF Module Packaging and Protection
- High-power semiconductor devices
- Advanced electronic systems requiring thermal management
- Industrial power electronics
- Telecommunications equipment
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