High Frequency Ceramic Circuit Board LTCC / HTCC Multilayer Interconnect For RF Modules
Brand Name:
XQCERA
Model Number:
Customization
Place of Origin:
Hunan, China
Certification:
IATF16949;ISO9001
MOQ:
100
Price:
Customization
Delivery Time:
20-30 working days
Payment Terms:
TT wire transfer
Standard Packaging:
Carton; Pallet
Product Details
Highlight:
High Frequency Ceramic Circuit Board
,Ceramic Circuit Board LTCC
,Ceramic Circuit Board HTCC
Material:
Zirconia Ceramic (ZrO₂, Y-TZP)
Purity:
≥94% / ≥95% (custom Grades Available)
Density:
≥6.0 G/cm³
Fracture Toughness:
6–10 MPa·m½
Flexural Strength:
≥900–1200 MPa
Hardness:
≥88–92 HRA
Color:
White / Black / Customized
Max Working Temperature:
800–1600°C
Surface Finish:
Polished / Ground
Thermal Shock Resistance:
Excellent
Electrical Insulation:
Excellent
Corrosion Resistance:
Excellent
Wear Resistance:
Excellent
Customization:
Size, Tolerance, Diameter, Thickness,holes, Metallization Optional
Product Description
Detailed Specifications & Features
High-Frequency Ceramic Circuit Board (LTCC/HTCC) | Multilayer Interconnect for RF Modules, Sensors & Advanced Packaging
Multilayer Interconnect for RF Modules, Sensors & Advanced Packaging
Our high-frequency ceramic circuit boards utilize advanced LTCC (Low Temperature Co-fired Ceramic) and HTCC (High Temperature Co-fired Ceramic) technologies to deliver superior performance in demanding electronic applications. These multilayer interconnect solutions are engineered for optimal signal integrity and thermal management in RF modules, sensor systems, and advanced packaging applications.
- Exceptional high-frequency performance for RF and microwave applications
- Superior thermal conductivity and heat dissipation capabilities
- Excellent dimensional stability and mechanical strength
- Multilayer integration for complex circuit designs
- Compatible with various metallization systems
- Ideal for harsh environment applications
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