High Purity Alumina Ceramics Sintering Plate / Setter Plate In MLCC Chip Resistor

Brand Name: XQCERA
Model Number: Customization
Place of Origin: Hunan, China
Certification: IATF16949;ISO9001
MOQ: 100
Price: Customization
Delivery Time: 20-30 working days
Payment Terms: TT wire transfer
Standard Packaging: Carton; Pallet
Product Details
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Alumina Ceramics Sintering Plate

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High Purity Alumina Ceramics

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Alumina Ceramic Setter Plate

Material: Alumina Ceramic (Al₂O₃)
Density: 3.6–3.9 G/cm³
Hardness: ≥85–90 HRA
Max Working Temperature: 1600–1700°C
Surface Finish: Ground / Polished / Lapped
Thermal Shock Resistance: Excellent
Electrical Insulation: Excellent
Corrosion Resistance: Excellent
Customization: Size, Tolerance, Diameter, Thickness,holes, Metallization Optional
Content: Al₂O₃ (90% / 92% / 95% / 99% / 99.8% Alumina Available)
Flexural Strength: 300–500 MPa
Compressive Strength: ≥2000 MPa
Wear Resistance: Excellent
Precision Tolerance: ±0.001–0.03 Mm
Color: White / Ivory
Product Description
Detailed Specifications & Features
Ceramic Sintering Plate / Setter Plate | High-Purity Alumina for Stable Support in MLCC, Chip Resistor & Electronic Firing
Product Overview

Our ceramic sintering plates are precision-engineered substrates designed for high-temperature sintering processes across multiple industries. Manufactured using advanced ceramic materials, these plates provide exceptional thermal stability, chemical resistance, and dimensional consistency in demanding production environments.

Technical Specifications
Parameter Alumina (Al₂O₃) Zirconia (ZrO₂) Silicon Carbide (SiC) Aluminum Nitride (AlN)
Purity 96%, 99%, 99.5% 95% YSZ, 99% TZP 98%, 99% 95%, 99%
Maximum Service Temperature 1600°C 1500°C 1650°C 1800°C
Thermal Expansion Coefficient 7.2*10⁻⁶/K 10.5*10⁻⁶/K 4.5*10⁻⁶/K 4.5*10⁻⁶/K
Thermal Conductivity 25-35 W/m·K 2-3 W/m·K 80-120 W/m·K 140-180 W/m·K
Flexural Strength 300-400 MPa 800-1200 MPa 400-500 MPa 300-400 MPa
Surface Finish Ra 0.4-1.6 μm Ra 0.2-0.8 μm Ra 0.4-1.2 μm Ra 0.4-1.6 μm
Flatness Tolerance ±0.1% ±0.05% ±0.1% ±0.08%
Standard Thickness 5-50 mm 3-30 mm 6-60 mm 4-40 mm
Material Advantages Comparison
Alumina Sintering Plates
  • Best For: General-purpose sintering, electronic ceramics

  • Cost Efficiency: Most economical option

  • Features: Good thermal shock resistance, excellent electrical insulation

  • Typical Applications: PCB substrates, ceramic capacitors, spark plug insulators

Zirconia Sintering Plates
  • Best For: High-strength requirements, dental/medical ceramics

  • Key Feature: Transformation toughening mechanism

  • Advantages: Highest fracture toughness among ceramics

  • Applications: Dental crowns, biomedical implants, cutting tools

Silicon Carbide Sintering Plates
  • Best For: Ultra-high temperature processes, rapid thermal cycling

  • Superior Properties: Exceptional thermal conductivity, wear resistance

  • Applications: Semiconductor wafer processing, metallurgy, kiln furniture

Aluminum Nitride Sintering Plates
  • Best For: High-power electronic applications

  • Unique Feature: High thermal conductivity with electrical insulation

  • Applications: LED substrates, power modules, laser diode carriers

Specialized Product Lines
1. Micro-Porous Sintering Plates
  1. Porosity: 10-40% customizable

  2. Pore Size: 1-100 μm range

  3. Applications: Filter sintering, catalyst supports, biomedical scaffolds

  4. Materials: Alumina, Zirconia, Hydroxyapatite

2. Multi-Layer Laminated Plates
  1. Construction: 3-10 ceramic layers with controlled CTE gradients

  2. Benefits: Eliminates warpage, reduces thermal stress

  3. Applications: LTCC/HTCC processes, multilayer capacitor sintering

3. Surface-Treated Plates
  1. Coatings: BN, AlN, Si₃N₄, Y₂O₃ coatings available

  2. Benefits: Non-stick surface, easy release, contamination prevention

  3. Applications: Powder metallurgy, MIM parts, specialty alloys

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